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INDAR (INnovative Disassembling Adhesives Research): a debonding process for structural debondable adhesives

Rescoll'Blog / 13 juillet 2011






Structural adhesives are nowadays widely used in numerous industries like automotive, aerospace, avionics or microelectronics … for many reasons such as easy processing or weight and cost savings. A strong effort has been achieved so far to enhance the level of adherence in structural assemblies and in this particular case a new challenge appears: the easy dismantling of structural bonded joints. This innovative concept results from industrial constrains like maintenance or recycling needs where debonding on command is a new function expected from the adhesive formulations.

Rescoll Technological Center has developed and patented a debonding process, INDAR Inside® that offers a simple and efficient solution to the disassembling of structural bonds. Based on the use of specific additives activated by heating at a certain temperature, this new technology drastically reduces the dismantling time and fulfill the main characteristics required by this application, like no change in processing (implementation, curing conditions,…) and no or slight modification of the mechanical properties.

The activation of the additive is a reaction of sublimation which releases a high amount of gas in adhesive joint. The gas migrates by diffusion from the bulk to interfaces generating local stresses leading to bonding dismantlement.

This debondable process is nowadays used in fields such as aeronautics, spatial or automotive industries.

Download the Indar's leaflet

More info: rf.ll1558365817ocser1558365817@evil1558365817o.emi1558365817xam1558365817>rf.ll1558365817ocser1558365817@evil1558365817o.emi1558365817xam1558365817