Do you know the INDAR (INnovative Disassembling Adhesives Research) process to obtain structural debondable adhesives?

The INDAR technology is based on the use of additives able to generate gases upon heating. With a suitable combination of joint modulus and activation source, we concentrate these gases at the interface between the adhesive and the substrate. These gases then generates stresses and interfacial debonding with clean substrates, free from residues.
3 main temperatures are available:120°C, 160°C and 200°C.
INDAR can be used in the following adhesives:
-1K PU (cold and warm extruded)
-2K PU
The INDAR technology is based on the use of additives able to generate gases upon heating. With a suitable combination of joint modulus and activation source, we concentrate these gases at the interface between the adhesive and the substrate. These gases then generates stresses and interfacial debonding with clean substrates, free from residues.
3 main temperatures are available:
-2K epoxy
-2k acrylics
-1K and 2K silicones

For further details, you can have a look at the website : www.rescoll.fr under “our technologies”, you will find documentation about this technology for dismantling.
This debondable technology has been successfully implemented for ground proof tests of the structure of the GAIA spacecraft (work with ASTRIUM SATELLITES) : in this epoxy formulation with lap shear and pull out values higher than 30MPa at room temperature, and manual disassembly after thermal activation.

For more information : maxime.olive@rescoll.fr

assemblages collés • INDAR • nadcap