Rescoll’Blog

disbonding

13 juillet 2011

INDAR (INnovative Disassembling Adhesives Research): a debonding process for structural debondable adhesives

        Structural adhesives are nowadays widely used in numerous industries like automotive, aerospace, avionics or microelectronics … for many reasons such as easy processing or weight and cost savings. A strong effort has been achieved so far to enhance the level of adherence in structural assemblies and in [...]

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