Rescoll'Blog

structural

17 février 2020

Meet RESCOLL at Aircraft Interiors Expo 2020

Once again this year, RESCOLL will be present in Hamburg for the largest gathering of cabin interior professionals, Aicraft Interiors Expo. An opportunity for us to meet you and for you to come and discover or rediscover all our activities in this field, our expertise and our qualifications. As a reminder, Rescoll is the largest [...]

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18 juillet 2011

RESCOLL at Spanish adhesion society congress.

 RESCOLL will be present at Spanish Adhesion Society Congress in San Sebastian from September 28 to 29. Tomas Bergara, technical engineer, will give a conference about INDAR debonding process. This technology offers a simple and efficient solution to the disassembling of structural bonds. Based on the use of specific additives [...]

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15 juillet 2011

INDAR debonding process: structural debondable adhesive used for ground testing of GAIA segments

Rescoll Technological Center has developed and patented a debonding process, INDAR Inside®, that offers a simple and efficient solution to the disassembling on command of structural bonds. Based on the use of specific additives activated by heating at a certain temperature, this new technology drastically reduces the dismantling time [...]

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