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RESCOLL at Spanish adhesion society congress.

Rescoll’Blog / 18 juillet 2011


RESCOLL will be present at Spanish Adhesion Society Congress in San Sebastian from September 28 to 29. Tomas Bergara, technical engineer, will give a conference about INDAR debonding process. This technology offers a simple and efficient solution to the disassembling of structural bonds. Based on the use of specific additives activated by heating at a certain temperature, this new technology drastically reduces the dismantling time and fulfill the main characteristics required by industrial applications, like no change in processing (implementation, curing conditions,…) and no or slight modification of the mechanical properties. An interesting application of this debondable adhesive technology for a spatial application will be detailed.