Rescoll'Blog

dismantling

18 juillet 2011

RESCOLL at Spanish adhesion society congress.

 RESCOLL will be present at Spanish Adhesion Society Congress in San Sebastian from September 28 to 29. Tomas Bergara, technical engineer, will give a conference about INDAR debonding process. This technology offers a simple and efficient solution to the disassembling of structural bonds. Based on the use of specific additives [...]

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15 juillet 2011

INDAR debonding process: structural debondable adhesive used for ground testing of GAIA segments

Rescoll Technological Center has developed and patented a debonding process, INDAR Inside®, that offers a simple and efficient solution to the disassembling on command of structural bonds. Based on the use of specific additives activated by heating at a certain temperature, this new technology drastically reduces the dismantling time [...]

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13 juillet 2011

INDAR (INnovative Disassembling Adhesives Research): a debonding process for structural debondable adhesives

        Structural adhesives are nowadays widely used in numerous industries like automotive, aerospace, avionics or microelectronics … for many reasons such as easy processing or weight and cost savings. A strong effort has been achieved so far to enhance the level of adherence in structural assemblies and in [...]

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